Visi dan Misi

Visi dan Misi

Vision
To be a world-leading supplier of encapsulation & packaging technologies for diodes and discrete components.

Mission
Customer satisfaction through innovative technology, quality, service, and competitive cost.

Background
‧ Founded by Dr. D. H. Hu and Mr. George Dai in June 1994.
‧ Company goal is to innovate the new generation technologies (GPRC / SRII / SuperChip) for diodes and discrete semiconductors to satisfy customer requirements.